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Zacks Investment Research upgraded Electro Scientific Industries, Inc. (NASDAQ:ESIO) to Hold in a report released today.

Zacks Investment Research has upgraded Electro Scientific Industries, Inc. (NASDAQ:ESIO) to Hold in a report released on 10/4/2016.

Yesterday Electro Scientific Industries, Inc. (NASDAQ:ESIO) traded -2.86% lower at $5.44. ESIO’s 50-day average is $5.67 and its two hundred day average is $6.38. With the last close down -14.69% relative to the two hundred day average, compared with the S&P 500 Index which has decreased -0.01% over the date range. Volume of trade was down over the average, with 86,830 shares of ESIO changing hands under the typical 221,452

Performance Chart

Electro Scientific Industries, Inc. (NASDAQ:ESIO)

Electro Scientific Industries, Inc. has with a 52 week low of $4.36 and a 52 week high of $7.56 and has a market cap of $0.

In addition to Zacks Investment Research reporting its target price, a total of 2 firms have issued a report on the stock. The consensus target price is $9.00 with one equity analyst rating the company a strong buy, one equity analyst rating the company a buy, zero equity analysts rating the company a hold, zero brokerages rating the stock a underperform, and finally 0 brokerages rating the stock a sell.

Brief Synopsis On Electro Scientific Industries, Inc. (NASDAQ:ESIO)

Electro Scientific Industries, Inc. and its subsidiaries supply laser-based manufacturing solutions for industries reliant on microtechnologies. The Company operates through two segments: Component Processing and Micromachining. The Component Processing segment includes interconnect products, semiconductor products and component products. The interconnect, semiconductor and component products are sold to manufacturers of electronic components and are used to drill, cut, trim, ablate and test and mark features for the functionality of the component. The Micromachining segment includes products that are sold to manufacturers of end devices across various industries and are used to drill, cut or mark features on a range of materials, generally on the casing or external surface of the end device. Its integrated solutions allow industrial designers and process engineers to control the power of laser light to transform materials. It has operations in Asia, Europe and North America.

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