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Zacks Investment Research downgraded Benchmark Electronics, Inc. (NYSE:BHE) to Hold in a statement released earlier today.

Having a price of $24.74, Benchmark Electronics, Inc. (NYSE:BHE) traded 1.77% higher on the day. The last close is up 11.67% from the two hundred day average, compared with the S&P 500 Index which has decreased -0.01% over the same time period. The company has recorded a 50-day moving average of $24.16 and a 200-day average of $22.15. Volume of trade was down over the average, with 206,874 shares of BHE changing hands under the typical 260,869

Zacks Investment Research has downgraded Benchmark Electronics, Inc. (NYSE:BHE) to Hold in a statement released on 9/21/2016.

Previously on 07/22/2016, Needham released a statement about Benchmark Electronics, Inc. (NYSE:BHE) bumped up the target price from $23.00 to $26.00. At the time, this indicated a possible upside of 0.14%.

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Benchmark Electronics, Inc. (NYSE:BHE)

With a total market value of $0, Benchmark Electronics, Inc. has 52 week low of $18.36 and a 52 week high of $24.82 with a P/E ratio of 15.03 .

Also covering Benchmark Electronics, Inc.'s target, a total of 5 analysts have reported on the stock. The consensus target price is $23.80 with 1 broker rating the stock a strong buy, 2 analysts rating the company a buy, two firms rating the stock a hold, zero equity analysts rating the company a underperform, and lastly 0 brokers rating the stock a sell.

About Benchmark Electronics, Inc. (NYSE:BHE)

Benchmark Electronics, Inc. is a provider of integrated electronic manufacturing services. The Company provides services to original equipment manufacturers of industrial control equipment, including equipment for the aerospace and defense industry; telecommunication equipment; computers and related products for business enterprises; medical devices, and testing and instrumentation products. It has three segments: the Americas, Asia and Europe. It offers integrated design and manufacturing services. Its operations consist of over three principal areas: manufacturing and assembly operations, including printed circuit boards assemblies and subsystem assembly, box build and systems integration; precision technology manufacturing, which include precision machining, metal joining, assembly and functional testing, and specialized engineering services, and specialized engineering services, such as product design, printed circuit board layout, prototyping, automation and test development.

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