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KLA-Tencor (NASDAQ:KLAC) target raised to $84.00, reported today by Needham

Having a price of $71.79, KLA-Tencor (NASDAQ:KLAC) traded 0.81% higher on the day. With the last stock price down -0.01% from the two hundred day average, compared with the S&P 500 Index which has decreased -0.01% over the same period. KLA-Tencor has recorded a 50-day average of $69.64 and a two hundred day average of $71.80. 15,109,529 shares of KLAC traded hands, up from an average trading volume of 1,572,760

KLA-Tencor (NASDAQ:KLAC) had its stock price target increased to $84.00 by Needham in a report released 10/7/2016. The new target price indicates a possible upside of 0.17% from the company's most recent stock price.

Recent Performance Chart


KLA-Tencor has a 52 week low of $51.16 and a 52 week high of $77.85 with a P/E ratio of 15.99 KLAC’s total market value is presently $0.

A total of 12 brokerages have reported on the stock. zero equity analysts rating the company a strong buy, two brokerages rating the company a buy, thirteen brokers rating the stock a hold, zero equity analysts rating the company a underperform, and finally 0 firms rating the company a sell with a one year target of $71.75.

More About KLA-Tencor (NASDAQ:KLAC)

KLA-Tencor Corporation is a supplier of process control and yield management solutions for the semiconductor and related nanoelectronics industries. The Company's products are also used in various other industries, including the light emitting diode (LED) and data storage industries, as well as general materials research. KLA-Tencor's products and services are used by bare wafer, integrated circuit (IC), lithography reticle and disk manufacturers around the world. These customers turn to the Company for inline wafer and IC defect monitoring, review and classification; reticle defect inspection and metrology; packaging and interconnect inspection; critical dimension (CD) metrology; pattern overlay metrology; film thickness, surface topography and composition measurements; measurement of in-chamber process conditions, wafer shape and stress metrology; computational lithography tools, and overall yield and fab-wide data management and analysis systems.

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