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KLA-Tencor Corp (NASDAQ:KLAC) target price raised to $84.00, reported today by Needham & Company LLC

KLA-Tencor Corp (NASDAQ:KLAC) had its target price raised to $84.00 by Needham & Company LLC in a report released Friday October 07, 2016. The new target price indicates a possible upside of 0.17% based on the company's last stock close price.

Yesterday KLA-Tencor Corp (NASDAQ:KLAC) traded 1.23% higher at $72.03. The company’s 50-day moving average is $69.72 and its 200-day moving average is $71.81. The last stock close price is up 1.20% from the 200-day moving average, compared to the S&P 500 which has decreased -0.01% over the same time. 7,733,661 shares of the stock were exchanged, up from an average trading volume of 1,662,670

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KLA-Tencor Corp has a price-earnings ratio of 16.18 with a one year low of $51.16 and a one year high of $77.85 KLAC’s total market value is presently $0.

A total of 12 equity analysts have released a ratings update on KLAC. zero equity analysts rating the company a strong buy, two equity analysts rating the company a buy, thirteen equity analysts rating the company a hold, zero equity analysts rating the company a underperform, and finally zero equity analysts rating the company a sell with a one year target of $71.75.

Brief Synopsis About KLA-Tencor Corp (NASDAQ:KLAC)

KLA-Tencor Corporation is a supplier of process control and yield management solutions for the semiconductor and related nanoelectronics industries. The Company's products are also used in various other industries, including the light emitting diode (LED) and data storage industries, as well as general materials research. KLA-Tencor's products and services are used by bare wafer, integrated circuit (IC), lithography reticle and disk manufacturers around the world. These customers turn to the Company for inline wafer and IC defect monitoring, review and classification; reticle defect inspection and metrology; packaging and interconnect inspection; critical dimension (CD) metrology; pattern overlay metrology; film thickness, surface topography and composition measurements; measurement of in-chamber process conditions, wafer shape and stress metrology; computational lithography tools, and overall yield and fab-wide data management and analysis systems.

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