KLA-Tencor Corp (NASDAQ:KLAC) target price raised to $78.00, issued a report today by Zacks Investment Research
- Updated: October 2, 2016
KLA-Tencor Corp (NASDAQ:KLAC) had its price target upped to $78.00 by Zacks Investment Research in an issued report issued 09/28/2016. The updated stock price target indicates a possible upside of 0.12% based on the company's most recent stock price close.
Boasting a price of $69.90, KLA-Tencor Corp (NASDAQ:KLAC) traded 1.37% higher on the day. The last stock close price is down -2.89% from the 200-day moving average, compared to the S&P 500 which has decreased -0.01% over the same period. KLAC has recorded a 50-day average of $69.43 and a two hundred day average of $71.78. Trade Volume was up over the average, with 1,466,204 shares of KLAC changing hands over the typical 1,344,760
Recent Performance Chart
KLA-Tencor Corp has PE ratio of 15.53 with a one year low of $50.53 and a one year high of $77.85 and has a market capitalization of $0.
A total of 12 analysts have released a report on the company. 0 brokers rating the stock a strong buy, 2 brokers rating the stock a buy, 13 brokerages rating the stock a hold, 0 brokerages rating the stock a underperform, and finally 0 brokerages rating the stock a sell with a average stock price target of $71.75.
Brief Synopsis On KLA-Tencor Corp (NASDAQ:KLAC)
KLA-Tencor Corporation is a supplier of process control and yield management solutions for the semiconductor and related nanoelectronics industries. The Company's products are also used in various other industries, including the light emitting diode (LED) and data storage industries, as well as general materials research. KLA-Tencor's products and services are used by bare wafer, integrated circuit (IC), lithography reticle and disk manufacturers around the world. These customers turn to the Company for inline wafer and IC defect monitoring, review and classification; reticle defect inspection and metrology; packaging and interconnect inspection; critical dimension (CD) metrology; pattern overlay metrology; film thickness, surface topography and composition measurements; measurement of in-chamber process conditions, wafer shape and stress metrology; computational lithography tools, and overall yield and fab-wide data management and analysis systems.
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