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KLA-Tencor Corp (NASDAQ:KLAC) has been upgraded to Buy in a statement by Berenberg Bank earlier today.

Berenberg Bank has upgraded KLA-Tencor Corp (NASDAQ:KLAC) to Buy in a statement released on 10/06/2016.

On 9/28/2016, Zacks Investment Research released a statement on KLA-Tencor Corp (NASDAQ:KLAC) upped the target price from $0.00 to $78.00 that suggested an upside of 0.12%.

Having a price of $68.60, KLA-Tencor Corp (NASDAQ:KLAC) traded 1.23% higher on the day. With the last stock price close down 1.20% from the two hundred day average, compared with the S&P 500 Index which has decreased -0.01% over the date range. KLAC has recorded a 50-day moving average of $69.72 and a 200-day moving average of $71.81. 7,733,661 shares of KLAC traded hands, up from an average trading volume of 1,662,670

Recent Performance Chart

KLA-Tencor Corp (NASDAQ:KLAC)

KLA-Tencor Corp has 52 week low of $51.16 and a 52 week high of $77.85 with a PE ratio of 16.18 and has a market capitalization of $0.

In addition to Berenberg Bank reporting its stock price target, a total of 12 firms have reported on the stock. The consensus target price is $71.75 with 0 firms rating the stock a strong buy, 2 firms rating the stock a buy, 13 brokers rating the stock a hold, 0 brokers rating the stock a underperform, and finally 0 brokers rating the stock a sell.

General Information About KLA-Tencor Corp (NASDAQ:KLAC)

KLA-Tencor Corporation is a supplier of process control and yield management solutions for the semiconductor and related nanoelectronics industries. The Company's products are also used in various other industries, including the light emitting diode (LED) and data storage industries, as well as general materials research. KLA-Tencor's products and services are used by bare wafer, integrated circuit (IC), lithography reticle and disk manufacturers around the world. These customers turn to the Company for inline wafer and IC defect monitoring, review and classification; reticle defect inspection and metrology; packaging and interconnect inspection; critical dimension (CD) metrology; pattern overlay metrology; film thickness, surface topography and composition measurements; measurement of in-chamber process conditions, wafer shape and stress metrology; computational lithography tools, and overall yield and fab-wide data management and analysis systems.

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