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HSBC Holdings plc downgraded Taiwan Semiconductor Mfg. Co. Ltd. (ADR) (NYSE:TSM) to Hold in a statement released earlier today.

Yesterday Taiwan Semiconductor Mfg. Co. Ltd. (ADR) (NYSE:TSM) traded -0.87% lower at $36.71. The company’s 50-day moving average is $36.52 and its 200-day moving average is $34.71. The last stock close price is up 8.12% from the 200-day moving average, compared to the Standard & Poor's 500 Index which has increased 0.04% over the same time period. 4,983,362 shares of TSM traded hands, down from an average trading volume of 5,476,900

HSBC Holdings plc has downgraded Taiwan Semiconductor Mfg. Co. Ltd. (ADR) (NYSE:TSM) to Hold in a statement released on 6/21/2017.

On Thursday June 15, 2017, Zacks Investment Research released a statement for Taiwan Semiconductor Mfg. Co. Ltd. (ADR) (NYSE:TSM) bumped up the target price from $0.00 to $40.00 that indicated a possible upside of 0.12%.

Recent Performance Chart

Taiwan Semiconductor Mfg. Co. Ltd. (ADR) (NYSE:TSM)

Taiwan Semiconductor Mfg. Co. Ltd. (ADR) has 52 week low of $28.34 and a 52 week high of $37.94 with a PE ratio of 16.87 and has a market cap of $0.

In addition to HSBC Holdings plc reporting its stock price target, a total of 5 brokers have issued a report on the company. The average stock price target is $25.46 with 1 broker rating the stock a strong buy, 2 brokers rating the stock a buy, 1 broker rating the stock a hold, two analysts rating the company a underperform, and lastly zero analysts rating the company a sell.

General Company Details For Taiwan Semiconductor Mfg. Co. Ltd. (ADR) (NYSE:TSM)

Taiwan Semiconductor Manufacturing Company Limited (TSMC) is a semiconductor foundry. The Company is engaged in the manufacturing, selling, packaging, testing and computer-aided design of integrated circuits and other semiconductor devices and the manufacturing of masks. It operates through foundry segment. The foundry segment is engaged in manufacturing, selling, packaging, testing and computer-aided design of integrated circuits (IC) and other semiconductor devices and the manufacturing of masks. It operates three 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). It also manages two eight-inch fabs at its subsidiaries, WaferTech, LLC in the United States and TSMC China Company Limited. Its exploratory work focuses on transistors and technologies, such as three dimensional (3D) structures, strained-layer complementary metal-oxide semiconductor (CMOS), high-mobility materials and 3D IC devices.

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