Breaking Finance News

Amkor Technology, Inc. (NASDAQ:AMKR) target price raised to $11.00, reported today by Zacks Investment Research

Yesterday Amkor Technology, Inc. (NASDAQ:AMKR) traded -3.78% lower at $9.43. The company’s 50-day moving average is $9.28 and its 200-day moving average is $7.03. The last stock close price is up 34.11% from the 200-day moving average, compared to the S&P 500 which has decreased -0.01% over the same time. 949,139 shares of the stock were exchanged, down from an average trading volume of 1,410,610

Amkor Technology, Inc. (NASDAQ:AMKR) had its target price raised to $11.00 by Zacks Investment Research in a report released 10/11/2016. The new target price indicates a possible upside of 0.17% based on the company's last stock close price.

See Chart Below

Amkor Technology, Inc. (NASDAQ:AMKR)

Amkor Technology, Inc. has a 52 week low of $4.09 and a 52 week high of $10.13 with a P/E ratio of 83.45 The company’s market cap is currently $0.

In addition to Zacks Investment Research reporting its target price, a total of 4 firms have reported on the stock. The consensus target price is $5.99 with 0 firms rating the stock a strong buy, 2 firms rating the stock a buy, 2 firms rating the stock a hold, 0 firms rating the stock a underperform, and finally 0 firms rating the stock a sell.

About Amkor Technology, Inc. (NASDAQ:AMKR)

Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology employed, size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. Fabless semiconductor companies focuses on the semiconductor design process and manufacturing process. Its packages employ wirebond, flip chip, copper clip and other interconnect technologies. It uses leadframe and substrate package carriers, and performs a range of test services.

Receive News & Ratings Via Email - Enter your email address below to receive a concise daily summary of the latest news and analysts' ratings with's FREE daily email newsletter.

Leave a Reply

Your email address will not be published. Required fields are marked *