A statement released earlier today by B. Riley about KLA-Tencor Corp (NASDAQ:KLAC) ups the target price to $86.00
- Updated: October 8, 2016
B. Riley raised the target price of KLA-Tencor Corp (NASDAQ:KLAC) to $86.00 reporting a potential upside of 0.25%.
Previously on 9/28/2016, Zacks Investment Research reported about KLA-Tencor Corp (NASDAQ:KLAC) increased the target price from $0.00 to $78.00 that suggested an upside of 0.12%.
Having a price of $68.60, KLA-Tencor Corp (NASDAQ:KLAC) traded 1.23% higher on the day. With the last close down 1.20% from the two hundred day average, compared with the Standard & Poor's 500 Index which has decreased -0.01% over the same time period. The company has recorded a 50-day moving average of $69.72 and a 200-day moving average of $71.81. 7,733,661 shares of KLAC traded hands, up from an avg. volume of 1,662,670
With a market capitalization of $0, KLA-Tencor Corp has P/E ratio of 16.18 with a 52 week low of $51.16 and a 52 week high of $77.85 .
A total of 12 brokerages have issued a ratings update on KLA-Tencor Corp. 0 brokers rating the company a strong buy, two equity analysts rating the stock a buy, 13 firms rating the company a hold, zero brokers rating the stock a underperform, and finally 0 brokerages rating the stock a sell with a average stock price target of $71.75.
About KLA-Tencor Corp (NASDAQ:KLAC)
KLA-Tencor Corporation is a supplier of process control and yield management solutions for the semiconductor and related nanoelectronics industries. The Company's products are also used in various other industries, including the light emitting diode (LED) and data storage industries, as well as general materials research. KLA-Tencor's products and services are used by bare wafer, integrated circuit (IC), lithography reticle and disk manufacturers around the world. These customers turn to the Company for inline wafer and IC defect monitoring, review and classification; reticle defect inspection and metrology; packaging and interconnect inspection; critical dimension (CD) metrology; pattern overlay metrology; film thickness, surface topography and composition measurements; measurement of in-chamber process conditions, wafer shape and stress metrology; computational lithography tools, and overall yield and fab-wide data management and analysis systems.
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